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Beamline 3.3.2

Deep-Etch X-Ray Lithography

Operational

Now

Source characteristics

Bend magnet (7 horizontal mrad at 17 m from bend magnet)

Energy range

3 - 12 keV

Monochromator

None

Calculated flux (1.9 GeV, 400 mA)

2.7 x 1013 photons/sec/0.1%BW

Endstation

Deep-etch x-ray lithography

Characteristics

Hutchless, self-contained scanner and shutter endstation

Spot size at sample

10 cm x 1.3 mm

Scientific applications

Research and development on deep-etch x-ray lithography such as LIGA (micromachining of high-aspect-ratio microstructures)

Local contact

Name: Cheryl Hauck
Phone: (510) 486-7885
Fax: (510) 486-4102
Email: cahauck@lbl.gov

Spokesperson

Name: Jill Hruby
Affiliation: Sandia National Laboratories
Phone: (925) 294-2596
Fax: (925) 294-3410
Email: jmhruby@sandia.gov

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